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What Information Is Required to Customize a Wafer Packaging Machine?

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2026-10-08

Successful customization of food packaging machinery begins with accurate product, packaging, production, and factory information. For a wafer automatic packaging line, the supplier should receive product drawings or physical samples, pack dimensions, product orientation, stacking requirements, film specifications, target output, sealing preferences, coding details, utility conditions, and information about connected equipment.

Customization Information at a Glance

  • Send product drawings or samples showing wafer length, width, height, shape, coating, and permitted travel direction.
  • Define the finished pack, including pillow-pack size, fin-seal and end-seal requirements, film type, film width, and bag length.
  • State the required speed, pieces per pack, stacking pattern, number of lanes, feeding method, and acceptable product spacing.
  • Provide site and integration details covering electrical supply, compressed air, conveyors, printers, inspection systems, cartoning, case packing, and palletizing.

How the Required Data Determines the Machine Design

A wafer packaging system normally moves through several coordinated stages: product loading, alignment or accumulation, stacking, film forming, longitudinal sealing, transverse sealing, cutting, and finished-pack discharge. Each stage is affected by the product envelope and the required pack format. Product drawings therefore help engineers size the infeed guides, stacking mechanism, film former, sealing area, and discharge conveyor.

The product description should identify the specific wafer type, such as wafer biscuits, wafer bars, cream-filled wafers, sandwich wafers, or chocolate-coated products. Orientation is especially important because the machine is configured for horizontal product transport. When a package contains several wafers, the request should specify the number of pieces and the desired collating pattern. The available design can support automatic stacking of 2 to 6 wafers per package, with single-lane, 2-lane, or 4-lane feeding options.

Wafer automatic packaging system for horizontal flow wrapping

Finished-Pack and Film Specifications

The packaging drawing should list the intended finished-pack length, width, and height. It should also include the film width and the required bag-making length. The documented equipment range covers film widths from 90 to 900 mm, adjustable bag lengths from 60 to 400 mm, product widths up to 350 mm, and product heights up to 120 mm. The final working range depends on the product, film structure, and selected packaging style.

Film data should cover the heat-sealable laminate, for example OPP, CPP, PET/Alu/PE, or metallized film. If printed film is used, provide the registration mark position and tracking requirements. A photoelectric registration system can be used, with stated accuracy of plus or minus 1 mm. The customization brief should also indicate whether the line needs film preheating, a hot-wheel longitudinal seal, a straight or serrated cutter, automatic film splicing, or closed-loop film-tension control.

Wafer flow packaging machine film forming and sealing section

Capacity, Feeding, and Controls

Production planning must state the desired packs per minute and the expected daily operating schedule. Depending on the model and product dimensions, the complete system is listed with a typical capacity of 100 to 1,000 packs per minute. The horizontal flow-wrapper section is specified at approximately 30 to 250 packs per minute, while high-speed servo versions may achieve greater output. The final capacity should be checked against product size, bag length, lane count, and sealing-jaw design.

Feeding information should explain whether the products arrive in one stream or several lanes, how they are spaced, and whether accumulation is required before stacking. Control preferences should include the desired servo configuration, number of stored recipes, operator-interface language, and communication protocol. The available control architecture may include a PLC master controller, distributed servo drives, 3-servo, 4-servo, or full-servo configurations, a 7 to 15.6 inch color touchscreen, multilingual operation, recipe management, EtherCAT or CANopen communication, alarm records, and remote troubleshooting.

Integration and Installation Requirements

Downstream equipment drawings should identify the locations, elevations, and transfer directions of checkweighers, metal detectors, labelers, cartoners, case packers, conveyors, and palletizing systems. The wafer line can include automatic rejection for missing products, defective seals, or weight deviations. It can also be connected to weighing, metal detection, labeling, cartoning, and robotic palletizing equipment, provided that the interface dimensions and control signals are defined in advance.

Factory information should include the available voltage, phase, frequency, compressed-air pressure and consumption, usable floor area, access route, ceiling clearance, and equipment height. Supported electrical conditions include 220V, 380V, or 400V three-phase power at 50 or 60 Hz. Depending on the model, installed power is approximately 3 to 12 kW, while compressed air is typically supplied at 5 to 6 bar with consumption of 20 to 50 L/min. Documented line dimensions range from 3,000 to 5,000 mm long, 800 to 1,500 mm wide, and 1,400 to 1,800 mm high.

Testing with representative wafer samples is recommended before final approval. Product trials allow the engineering team to verify infeed stability, alignment, stacking, sealing quality, rejection performance, and finished-pack appearance. Foshan Ruipuhua Machinery Equipment Co. Ltd holds CE certification applicable to flow packaging machines, automatic packaging systems, cartoning machines, and palletizing robots. A bakery project involving cake-pie wrapping and robotic palletizing also demonstrates experience with coordinated food-packaging lines.

Customization Data and Corresponding Design Decisions

Information to submitDetails to includeMachine elements affected
Product drawing and sampleDimensions, shape, coating, orientation, and product tolerancesGuides, infeed, stacking unit, film path, and sealing clearance
Pack and film specificationPack size, film material, film width, bag length, and print registrationFilm former, fin seal, end seal, cutter, and coding arrangement
Output targetPacks per minute, shift pattern, and single- or multi-lane operationFeeding speed, servo system, sealing jaws, and line capacity
Grouping requirementsPieces per pack, stacking order, spacing, and collating patternAccumulation, stacking, transfer, and product timing
Site conditionsPower, compressed air, floor space, access, and line elevationUtilities, machine dimensions, placement, and commissioning
Secondary packagingInspection, labeling, cartoning, case packing, and palletizing dataDischarge conveyor and downstream equipment interfaces

Frequently Asked Questions

Which product drawings are needed for wafer packaging equipment?

Provide drawings or samples showing the wafer or wafer-bar length, width, height, shape, coating, travel direction, and required stacking pattern. This information is used to configure the feeding, alignment, film-forming, and sealing sections.

What film details should be confirmed before machine design?

Specify the film structure, width, reel diameter, bag length, sealability, printed registration marks, and preferred sealing method. Typical compatible heat-sealable materials include OPP, CPP, PET/Alu/PE, and metallized films.

What information is required from the factory?

Share the electrical voltage, phase, frequency, compressed-air pressure and flow, available floor area, access limitations, ceiling height, line elevation, and connection points for inspection or secondary-packaging machines. The stated compressed-air requirement is generally 5 to 6 bar.

Why are product samples useful during customization?

Real samples allow the supplier to test product handling, stacking accuracy, sealing performance, cutting, rejection, and final pack quality. Sample trials can reveal adjustments that may not be apparent from drawings alone.

Conclusion and Recommendations

A complete request for a customized wafer packaging machine should combine product drawings or samples with pack dimensions, film information, output targets, feeding and stacking specifications, control preferences, utility data, and downstream equipment layouts. Confirming these details early helps the supplier select the correct machine size, servo configuration, sealing system, and integration method. The equipment supports OEM and custom manufacturing projects, with a stated minimum order quantity of 1 and sample testing available. For technical consultation, contact lotuspack@ruipuhua.com.

About Foshan Ruipuhua Machinery

Foshan Ruipuhua Machinery Equipment Co. Ltd, also known as RPH or RAPIDPACK, was founded in 2005. The company combines research and development, manufacturing, installation, and technical after-sales support for automatic packaging machinery. Its solutions are used for food, bakery products, biscuits, snacks, noodles, chocolate, soap, hardware, pharmaceutical products, and daily chemical goods, with exports to more than 100 countries. The company reports annual production of over 500 automatic packaging machines and complete packaging lines. Its CE certification covers flow wrapping machines, automatic packaging systems, cartoning machines, and palletizing robots.

Foshan Ruipuhua Machinery Equipment Co. Ltd logo

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